Mitsubishi 7th Generation IGBTs Reduce Power Losses, Feature Compact, Lightweight Package & Simply Assembly

In recent years, demand for industrial equipment such as general purpose inverters, elevators, uninterruptible power supply units (UPS), wind power/photovoltaic power generation, servo amplifiers and similar equipment has been steadily increasing as the demand for more efficient energy use and longer life of equipment is increasing.

In order to realize reduced power consumption and high reliability, Mitsubishi has developed the T Series IGBT module (NX type, std type) with 7th generation silicon and significantly improved internal packaging. The T Series facilitates reduction of power losses, revolutionary packaging, and simplification of assembly processes. A wide lineup meets most application needs.

 

 

Benefits include:

  • Reduced power loss of the applied products – The 7th Generation chipset features new, thinner IGBT chips and RFC diode chips (1200V, 1700V). By adopting the 7th Generation chipset, it is possible to reduce the power loss of the applied products.

  • Revolutionary packaging / wide lineup – In the 7th Generation IGBT module, a new structure has been adopted for the NX and std type, respectively. The NX type uses a proprietary insulated metal baseplate (IMB) for better heat spacing and reduced package inductance. The typical solder layer between the baseplate and substrate has been eliminated, virtually eliminating thermal cycle fatigue, the most common IGBT failure mode. Solid lid cover (SLC) technology eliminates the lid and replaces it with direct potting resin to provide better thermal expansion properties. In the std type, the terminals are now ultrasonically-bonded and ceramic-bonded directly to copper. This replaces the copper base plate for better heat spreading. The std type has low inductance - 30% lower than conventional models due to optimizing the internal layout of the module. Both the NX and std types offer a wide lineup of 650V, 1200V and 1700V devices.

  • Simplification of the assembly process - Optional pre-applied phase change thermal interface material (PC-TIM) makes it possible to eliminate the grease coating step in manufacturing. In addition, the NX type offers optional press-fit pins to eliminate the soldering process to the control board.

 
 
 

Download Mitsubishi’s 7th Generation IGBT Module T/T1-Series Application Note (NX & std type)

 

 

Part Number

Package Type

Voltage (V)

Current (A)

CM450DX-24T

NX

1200

450

CM450DY-24T

std

1200

450

CM600DX-24T

NX

1200

600

CM600DY-24T

std

1200

600

CM800DX-24T1

NX

1200

800

CM450DX-34T

NX

1700

450

CM600DX-34T

NX

1700

600

COMPLETE LIST OF MITSUBISHI'S 7TH GEN IGBTs

 

 
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